MIS Auto Decaper  
- All the works necessary for decap are realized through   Auto Decaper.
- The automated robot decapsulation system that has been   developed first in the world
- The functions of milling, etching, heating, acetone cleaning,   drying, ultrasonic cleaning, and vision inspection available.
- Protecting workers from harmful chemicals
- Minimizing damage etching of copper in the case of copper   wired IC
- Minimizing the damage on the ball or the tape at the   bottom of a package
- Fast, safe, and efficient decapsulation
- Protecting workers and equipment through the built-in
  exhaust system
- The functions of checking decap results through enlarged   clear images, saving images, and printing images available.
- Dual heating (MIS-specialized technology)
- More precise, faster, and safer decap possible.
- Easy control through convenient GUI
- Repetitions made simple using recipe files
- Consumable gaskets are unnecessary and very small   amount of etching chemical is used.
- Expanded decap possibility for various sizes and patterns   of packages
- Minimal maintenance and repair costs, and long lifecycles
Item Description
Dimension 1420(W) x 875(D) x 1720(H) mm
Weight Approx. 250 kg
Procedure Milling, Etching, Heating, Cleaning, Ultrasonic Cleaning, Inspection
Handling IC Size 5x5 mm ~ 50x50 mm
(Minimum Milling Depth : Approx. 0.01 mm)
Etchant Fuming Nitric Acid, Sulfuric Acid
Cleaning Solution Acetone
Heating Temperature 1. Beam Heater : (Room Temp.)~ 400 °C
2. Jig Heater : (Room Temp.)~ 250 °C
Free Control by Dual Heating System
Ultrasonic 38~40 KHz
Process Time Milling: 1~2 min., Etching~Cleaning: 3~15 min. (Average Time)
Utility Rated Voltage : AC 220V/110V, 1 Phase
Rated Current : 15A
Rated Frequency : 50 ~ 60 Hz
Air Pressure : 6kg/㎠ (bar)
Fume Exhaust Line
De-Ionized Water Supply / Drain
Program User Interface : Window Based Graphical User Interface
Applications BGA, PBGA, BOC, DIP, QFP, CSP, SCSP, MCM, TSOP and etc.
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