MIS Auto Decaper  

- Automatic laser decapsulation system
- All types of semiconductor package can be removed 
- Any material(Au, Cu, Al) of wire part and 2nd bonding area   can be opened  
- Effective decapsulation solution for Cu wire chip : Minimize   the damage on Cu wire by chemical etching after laser   operation
- A few hundred microns of EMC on die surface can be   opened with chemical etching(by manual or MIS Wet Etch :   Minimal acid use) 
- Easy, simple, fast and safe operation
     > Vision camera provides real time image 
     > User can set the decap area by mouse drag / numerical         value input 
     > User can see laser decapsulation process & result         on monitor screen 
     > Superimposing X-ray image on real-time sample picture         is available 
     > Auto door lock : System door is not opened during         laser operation 
     > Automatic Z axis adjustment by PC program  
- User can observe the operation process through the   window(protected from laser radiation) 
- Repetitions made simple using recipe files 
- Fume & Dust can be exhausted (Option: Fume & Dust   collector)

Item Description
Laser ND YVO4 1064nm
Guide Laser 632nm Laser Class 2 (Red Beam)
Dimension 840(W) x 705(D) x 1500(H) mm
Weight Approx. 150 kg
Handling IC Size 2x2 mm ~ 100x100 mm
Vision Camera Color
Utility Rated Voltage : AC 220V, 1 Phase
Rated Current : 15A, Rated Frequency : 50 ~ 60 Hz
Program User Interface : Window Based Graphical User Interface
X-ray image data import available (Superimposition)
Option Fume & Dust Collector
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