MIS Auto Decaper  
- Automatic chemical-etching the multi-layer of die(wafer)
- The world’s first automation system.
- Easy control through convenient GUI
- Real-time inspection through enlarged images
- Repetitions made simple using recipe files
- Forced removal system for harmful gases
- Safety that needs no protective devices for workers
- All the processes necessary for deprocess realized in a unit   of system (wet etching, cleaning, ultrasonic, inspection)
- Minimal maintenance cost and long lifecycles
Item Description
Dimension 2495(W) x 1050(D) x 1820(H) mm
Weight Approx. 650 kg
Procedure Chemical Etching, Heating, De-Ionized Water, N₂Cleaning
Ultrasonic Cleaning, Drying
Handling Wafer Size 1x1 mm ~ 30x30 mm
Chemical Bath 4 ea Bath (2 ea bath heating)
Heating Temperature Bath Heating Type (2 ea bath): (Room Temp.)~ 150 °C
Cleaning System Ultrasonic & De-Ionized Water
Dry System Air/N₂gas, Beam Heater
Utility Rated Voltage : AC 220V/110V, 1 Phase
Rated Current : 15A
Rated Frequency : 50 ~ 60 Hz
Air Pressure : 6kg/㎠ (bar)
Fume Exhaust Line
De-Ionized Water Supply / Drain
Program User Interface : Window Based Graphical User Interface
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